DGAP-Adhoc: Diok RealEstate AG: DIOK Postpones Issuance of the Next Bond Tranche

The Management Board of Diok RealEstate AG (DIOK) decided in coordination with the banks involved to postpone the issuance of the third tranche of its 2018/2023 corporate bond, which was planned to move ahead at this time, until the first half-year of 2020, subject to the then prevailing market conditions. The reason for this is that the purchase agreements for the acquisition of the properties, which are to be partially financed with the issue proceeds, contain conditions precedent so that the purchase price payments will only be due at a later date than originally planned. The postponement of the bond tranche issuance implies no changes to the company's growth targets.